The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2002
Filed:
Mar. 14, 2000
Applicant:
Inventor:
Masaya Wajima, Shinminato, JP;
Assignee:
Murata Manufacturing Co., Ltd, Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01N 9/09 ;
U.S. Cl.
CPC ...
H01N 9/09 ;
Abstract
A method for manufacturing substrate elements includes providing a mother substrate, forming at least one elongated through-hole on the mother substrate such that an entire longitudinal end surface of the first substrate element and a portion of a lateral surface of the second substrate element are exposed, forming an electrode pattern on the inner surface of the at least one elongated through-hole, and cutting the mother substrate along lines extending in the vicinity of the longitudinal ends of the at least one elongated through-hole and in a direction that is substantially perpendicular to the longitudinal axis of the elongated through-hole.