The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2002

Filed:

Jun. 27, 1994
Applicant:
Inventors:

Wilhelm Rademacher, Limburgerhof, DE;

Helmut Walter, Obrigheim, DE;

Eberhard Peter Schott, Neustadt, DE;

Dale R. Carlson, Hillsborough, NC (US);

Lisa P. Schell, Raleigh, NC (US);

Charles W. Helpert, Durham, NC (US);

David E. Millhouse, Visalia, CA (US);

William M. Fletcher, Woodlake, CA (US);

Hans J. von Amsberg, Chapel Hill, NC (US);

Matthias Bratz, Speyer, DE;

Assignee:

BASF Aktiengesellschaft, Ludwigshafen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A01N 3/752 ;
U.S. Cl.
CPC ...
A01N 3/752 ;
Abstract

A process for improvement of the soil by reducing microbially formed ethylene in the soil by bringing compounds which bind ethylene or of which it is known that they inhibit ethylene biosynthesis between S-adenosyl-L-methionine and 1-aminocyclopropane-carboxylic acid or 1-aminocyclopropane-1-carboxylic acid and ethylene respectively, into the soil zone relevant for the root growth of higher plants and allowing them to act there on the soil microorganisms.


Find Patent Forward Citations

Rademacher, Wilhelm. (2002). Process and composition for soil improvement by reducing microbially formed ethylene in the soil (U.S. Patent No. 6369003). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6369003

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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