The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2002
Filed:
Aug. 31, 1999
Masaharu Okamura, Hiroshima-ken, JP;
Toshiki Miyachi, Higashihiroshima, JP;
Takeharu Suga, Hiroshima-ken, JP;
Nobuyuki Homi, Higashihiroshima, JP;
G P Daikyo Corporation, Higashihiroshima, JP;
Abstract
A method for joining thermoplastic resin molded products by pressing together joining surfaces of two molded products with electric resistance wire therebetween is provided, wherein the method comprising: a first step in which electric resistance wire is sandwiched between the joining surfaces of two molded products which are to be joined, pressure is applied at a first predetermined pressure, and current of a predetermined value is applied for a predetermined time to the electric resistance wire, so that the resin around the electric resistance wire is melted by the thermal energy produced in the electric resistance wire while the surfaces of the two molded products that are to be joined are held at a predetermined interval; and a second step in which, following the conclusion of the first step, the current being applied to the electric resistance wire is stopped, and a second predetermined pressure is applied to attach the molten resin under pressure.