The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2002

Filed:

Feb. 16, 2000
Applicant:
Inventors:

Yasuhiro Kobatake, Osaka, JP;

Kenji Kuranuki, Kyoto, JP;

Yukari Shimamoto, Kyoto, JP;

Hiromichi Yamamoto, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 9/00 ; H01G 9/02 ; H01G 5/38 ; B23P 1/900 ;
U.S. Cl.
CPC ...
H01G 9/00 ; H01G 9/02 ; H01G 5/38 ; B23P 1/900 ;
Abstract

A simple method of mass producing a plurality of solid electrolytic capacitor elopements can be performed to produce capacitors with reduced leakage current and excellent reliability. The method includes supplying a band metal, a first portion of which contains protrusions on which a dielectric layer, then a conductor layer are formed. A conductive polymer film is formed on the conductor layer by electrolytic polymerization starting from a conductive tape adhered on a second portion of the band metal. The conductive tape acts as a common positive electrode for polymerization and a plurality of electrodes connected independently to the protrusions as negative electrodes. Finally a plurality of capacitor elements are formed by laminating individual protrusions cut off from the band metal.


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