Semiconductor manufacturing method and semiconductor manufacturing apparatus

Abstract

Particles are prevented from clinging to the back of a water in the notch alignment of the wafer, and the problems encountered when a plurality of wafers were aligned all at once are solved. Three support poles are erected on a turntable . The substrate outer periphery of wafers is supported by the tapered portions of support pins protruding from the support poles . The turntable is driven by a single motor , and all of the wafers are rotated at once. During rotation, the notches of al the wafers are detected by an optical sensor provided to a sensor pole , and the angular position thereof is stored. The wafers are rotated an the basis of the angular position data, and notch alignment is performed successively, starting with the bottom wafer . The wafers that have undergone notch alignment are successively picked up by the pick-up support pins of pick-up poles , and are retracted from the support poles that are rotating for notch alignment. Once all of the alignments have been completed, the retracted wafers are returned to the support pins