The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2002

Filed:

Jun. 18, 1999
Applicant:
Inventors:

A. Dempsey McGregor, Mena, AR (US);

Marshall P. Toombs, Spotsylvania, VA (US);

James E. Brooks, Spotsylvania, VA (US);

Benjamin J. Meadows, Fredb., VA (US);

Assignee:

Virginia Semiconductor, Fredericksburg, VA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B28D 1/02 ;
U.S. Cl.
CPC ...
B28D 1/02 ;
Abstract

A holding unit is provided to support an ingot in a semiconductor wafer sawing machine, which minimizes the instability of a blade during a sawing process. The holding unit is formed from substantially the same material as an ingot resting thereon. The holding unit includes a top surface for receiving an ingot, a bottom surface, a pair of side walls, and a cavity formed in the holding unit. The cavity forms a plurality of break points in the holding unit. When contacted by the blade, the holding unit fractures at the break points to minimize the chipping of the wafer.


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