The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 09, 2002
Filed:
Mar. 30, 1999
Kuroda Precision Industries, Ltd., Kanagawa-ken, JP;
Abstract
Method for measuring the surface shape of a thin element such as a silicon wafer measures the surface shapes of one surface and the other surface of the thin element by independently measuring the distance each to one surface and to the other surface of the thin element by rotating or moving the thin element within a single plane and independently moving the first and second measuring means along the first and second guide shafts. Apparatus for measuring the surface shape of the thin element measures the surface shapes of one surface and the other surface of the thin element by rotating or moving the thin element supported within the same plane by a supporting means, and independently measuring the distance each to one surface and to the other surface of the thin element by the first and second measuring means while independently moving the first and second sliders along the first and second guide shafts. The method measures the thickness of each part of the thin element based on the surface shapes of one surface and the other surface of the thin element as measured by the method for measuring the surface shape of the thin element and the distance between the first and second measuring means.