Heat-dissipating assembly for removing heat from a flip chip semiconductor device

Abstract

A method and assembly ( ) for conducting heat from a semiconductor device, such as a power flip chip ( ). The assembly ( ) is generally constructed to dissipate heat from the chip ( ) when mounted to a flexible substrate ( ). Heat is conducted from the chip ( ) with a heat-conductive member ( ) brought into thermal contact with the surface of the chip ( ) opposite solder bump connections ( ) that attach the chip ( ) to the substrate ( ). A biasing member ( ) biases the substrate ( ) against the chip ( ) so as to maintain thermal contact between the chip ( ) and the heat-conductive member ( ). A thermally-conductive lubricant ( ) is preferably provided between the surface of the chip ( ) and the heat-conductive member ( ) in order to promote thermal contact while also decoupling any lateral mechanical strains that may arise as a result of different thermal expansions and movement between the chip ( ), substrate ( ) and heat-conductive member ( ). The substrate ( ) and chip ( ) are preferably enclosed within a housing ( ) that incorporates the heat-conductive member ( ). The housing ( ) may further include fins ( ) in order to promote heat dissipation from the housing ( ) to the environment.