The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2002
Filed:
Aug. 25, 2000
Applicant:
Inventor:
Toshiyasu Shimada, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/302 ;
U.S. Cl.
CPC ...
H01L 2/302 ;
Abstract
A stacked-chip semiconductor device includes a rigid insulator board having therein a central opening and thereon a wiring pattern, and a base insulator bonded to the rigid insulator board and having a wiring pattern. Both the wiring patterns are connected together via through-holes formed in the rigid insulator board. A first semiconductor chip is mounted on the base insulator film within the opening of the rigid insulator board, whereas a second semiconductor chip is mounted on the rigid insulator board overlying the opening.
Shimada, Toshiyasu. (2002). Stacked-chip semiconductor device (U.S. Patent No. 6365963). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6365963
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile