The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2002
Filed:
Feb. 10, 1999
Applicant:
Inventors:
Toshihiro Nishii, Hirakata, JP;
Shigeru Yamane, Hirakata, JP;
Shinji Nakamura, Katano, JP;
Hidenori Hayashi, Osaka, JP;
Toru Fujimoto, Katano, JP;
Toshiharu Okada, Ibaraki, JP;
Izuru Nakai, Toyonaka, JP;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 ;
U.S. Cl.
CPC ...
H05K 1/11 ;
Abstract
In manufacturing a double-layered or a multi-layered printed wiring board, a layer of metamorphic substance, which is created by transmuting a substrate material, is formed on an inner wall of a hole during a perforation process of the substrate utilizing radiation energy. The layer of metamorphic substance prevents conductive materials constituting electrical connection means formed on the inner wall of the hole from dispersing over a surface of the substrate or permeating into the substrate.