The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2002

Filed:

Apr. 17, 2000
Applicant:
Inventors:

Yutaka Kinose, Tokyo, JP;

Shinsuke Miyabe, Tokyo, JP;

Takeshi Sakamoto, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08K 3/36 ; C08L 6/302 ;
U.S. Cl.
CPC ...
C08K 3/36 ; C08L 6/302 ;
Abstract

The present invention relates to a fused spherical silica having a maximum particle size of 45 &mgr;m, an average particle size of 2 to 10 &mgr;m, and a ratio of a specific surface area S of the particles to a theoretical specific surface area S of the particles, S /S , of 1.0 to 2.5, the surface of the particles being smooth. The present invention can provide a liquid sealing resin composition having sufficiently low viscosity for sealing a slight gap between a substrate and an IC chip and also having high reliability, and a fused spherical silica filler to be filled therein.


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