The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2002
Filed:
Mar. 15, 2000
Applicant:
Inventors:
Takayuki Hayashi, Osaka, JP;
Toshihide Okatsu, Osaka, JP;
Assignee:
Kaneka Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/176 ;
U.S. Cl.
CPC ...
H01L 2/176 ;
Abstract
An apparatus for manufacturing a semiconductor device by forming a thin film on a substrate, comprises a cleaning process section for cleaning the substrate using a cleaning solution and a drying process section for jetting compressed gas onto the cleaned substrate, thereby removing the cleaning solution on the substrate, wherein the cleaning process section includes a nozzle body for jetting the cleaning solution onto the substrate under high pressure.