The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2002
Filed:
Jan. 22, 1997
Applicant:
Inventors:
Katsuhide Otani, Settsu, JP;
Kiyohiko Ihara, Settsu, JP;
Assignee:
Daikin Industries Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 1/418 ; B29D 2/300 ; B29D 2/200 ;
U.S. Cl.
CPC ...
C08F 1/418 ; B29D 2/300 ; B29D 2/200 ;
Abstract
The fine powder of high molecular weight fluorine containing resins having melt viscosities of 10 to 10 poise, apparent density of 0.4 to 1.5 g/cc, and specific surface area of 2 m /g or less, mold goods of the fine powder and these production methods. By utilizing the fine powder of high molecular weight flourine containing fused resins that have previously not been employed, the mold goods obtained from the fine powder have fewer liquated particles and have become the most suitable especially for manufacturing semiconductors. The powder's products have greater resistance to flex fatigue, abrasion, resistance, etc.