The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2002

Filed:

Jun. 12, 2001
Applicant:
Inventors:

Kurt I. Butler, Kingsville, OH (US);

Daniel G. Thomas, Conneaut, OH (US);

Assignee:

Quantum Composites Inc., Bay City, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 ; H01B 1/24 ;
U.S. Cl.
CPC ...
H01B 1/22 ; H01B 1/24 ;
Abstract

A technique and apparatus are disclosed for injection molding highly filled conductive resin compositions. These compositions include one or more of unsaturated polyester and vinyl ester resin; a copolymer having a terminal ethylene group; and at least about 50 weight percent of an inorganic particulate conductive filler, an initiator, and a rheological modifier to prevent phase separation between said resin and said conductive filler during molding. The method of the present invention allows these compositions to be molded into highly intricate and thin electrically and thermally conductive specimens without significant post process machining. The method involves the use of an injection molding apparatus that has a hopper with an auger having a vertical component in its positioning to feed into the feed throat of an injection molding machine which has a phenolic screw that has been modified to have a constant inner diameter and a constant flight depth.


Find Patent Forward Citations

Loading…