The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2002
Filed:
Oct. 06, 1999
Hon Hai Precision Ind. Co., Ltd., Taipei Hsien, TW;
Abstract
A method of manufacturing a high density connector comprises five steps. The first step is to prepare essential elements of the connector, such as a dielectric cover, a metallic shell, a pair of guiding members and a plurality of contacts. Each contact is L-shaped and comprises a horizontal soldering portion. The second step is to first insert mold a pair of dielectric bases around the contacts to produce a contact subassembly. The three step is to second insert mold a dielectric housing around the contact subassembly to form a contact module. The forth step is to adjust the horizontal soldering portions of the contacts for ensuring a good coplanarity thereof. The fifth step is to assemble the contact module with the cover, the shell and the guiding members, thereby completing the connector. The method of the present invention can produce connection with high density contacts having good insert-molding qualities by double insert molding to form the contact module, resulting in the horizontal soldering sections of the contacts having good coplanarity and having good electrical communication quality.