Stacked processor construction and a method for producing same

Abstract

The present invention provides an apparatus comprising a stacked processor construction and a method for creating the stacked processor construction. The stacked processor construction comprises two or more printed circuit boards (PCBs), each of which has at least one processor mounted thereon, and each of which has a local PCB bus. Each processor is electrically coupled to its respective local PCB bus. The PCBs are stacked substantially parallel to each other in such a way that the processors are not placed into contact with each other. The local PCB buses are electrically coupled together to enable the processors to communicate with each other. A stacking device is connected to the PCBs. The stacking device separates the PCBs a predetermined distance apart from one another and maintains the PCBs in planes that are substantially parallel to one another. The predetermined distance is at least large enough to prevent the processors from being in contact with each other. A group of conductive elements electrically couples the local buses together to enable the processors to communicate with each other. Preferably, the conductive elements are comprised by a high-speed connector, which functions as the stacking device.