The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2002

Filed:

Sep. 22, 1999
Applicant:
Inventors:

Michael Ray Bell, Dallas, TX (US);

Raymond G. Mayer, Plano, TX (US);

Vito Savino, Mesquite, TX (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ;
U.S. Cl.
CPC ...
H01L 2/3495 ;
Abstract

An improved package for a semiconductor device. The semiconductor device includes an apparatus having at least two access leads to facilitate electrical connection of the apparatus within an electrical circuit. The package has generally a closed polyhedral shape presenting a plurality of faces and substantially insulatingly surrounding the apparatus in a manner leaving the access leads exposed for effecting electrical connection. The access leads extend a distance from exit loci from the package. The exit loci are situated on an exit face of the package, adjacent pairs of exit loci being generally in a common plane. An intraplanar distance within the common plane is established intermediate each adjacent pair of the exit loci. The improvement comprises configuring the exit face to establish an on-surface path greater than the intraplanar distance intermediate selected adjacent pairs of the exit loci.


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