The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 2002
Filed:
Dec. 20, 1999
Joel Franklin Downey, Kokomo, IN (US);
John Karl Isenberg, Rossville, IN (US);
Delphi Technologies, Inc., Troy, MI (US);
Abstract
A conductor pad, formable on a substrate or a printed circuit board, for conducing the reduction of gas voids in solder when an electronic device is soldered to the conductor pad, wherein the conductor pad includes a uniform and electrically conductive base layer having an interface surface, and also includes a patterned layer formed on the interface surface of the base layer, wherein one of the base layer and the patterned layer is substantially non-wettable and the other is substantially wettable, and wherein the base layer and the patterned layer cooperatively define strips of non-wettable surface areas which extend across the interface surface of the base layer. The strips of non-wettable surface areas can be defined upon the interface surface of the base layer in various ways to thereby create various non-wettable patterns upon the base layer. Preferably, the base layer is substantially wettable, and the patterned layer is both substantially non-wettable and electrically conductive.