The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 26, 2002

Filed:

Feb. 10, 2000
Applicant:
Inventors:

Michael C. Cilia, Fremont, CA (US);

Gurpreet S. Dayal, Fremont, CA (US);

Don Nguyen, Sunnyvale, CA (US);

Arthur K. May, Cupertino, CA (US);

Assignee:

Sun Microsystems, Inc., Palo Alto, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 1/00 ;
U.S. Cl.
CPC ...
B23K 1/00 ;
Abstract

A rework nozzle includes a gripping device that is used to remove a soldered device from a circuit board. The rework nozzle attaches to a module that generates hot gas. The device that is to be removed from the circuit board is placed within the nozzle. The module generates hot gas, and the hot gas is directed by the nozzle to soldered connections that couple the device to the circuit board. The hot gas melts the solder and the gripping mechanism is used to grasp the device. The device may be removed from the circuit board by separating the circuit board from the nozzle after the hot gas melts the solder. The nozzle will release the device if the force needed to remove the device is greater than the force applied to the device by the gripping mechanism. The release of the device will prevent damage to the device or to the circuit board.


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