Method of electrically connecting and isolating components with vertical elements extending between interconnect layers in an integrated circuit

Abstract

A vertically oriented metal circuit element is electrically connected and isolated between vertically separated conductors of interconnect layers in an integrated circuit. The methodology involves connecting a lower end of the metal element to the lower interconnect layer at the lower end of an opening in an inter-layer dielectric, preferably by simultaneously forming the metal element and connecting it to the conductor by vapor deposition. An upper end of the metal element initially extends above an upper surface of the inter-layer dielectric, and chemical mechanical polishing is employed to reduce the upper end to a level flush with the upper surface of the inter-layer dielectric. The flush upper end of the metal element allows it to be precisely spaced and covered with dielectric material to obtain predictable and reliable electrical isolation characteristics. The electrical connection and isolation is obtained with a minimum of space to allow the metal element to the effectively positioned vertically between the interconnect layers.