The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 19, 2002

Filed:

Nov. 21, 2000
Applicant:
Inventors:

Jifa Hao, Mountaintop, PA (US);

Randall L. Case, Mansfield, PA (US);

John L. Benjamin, Mountaintop, PA (US);

Assignee:

Fairchild Semiconductor Corporation, South Portland, ME (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/122 ; H01L 2/1332 ;
U.S. Cl.
CPC ...
H01L 2/122 ; H01L 2/1332 ;
Abstract

In an improved process for controlling and improving minority carrier lifetime in a P-i-N diode, platinum is deposited on a surface of a silicon semiconductor substrate containing at least one PN junction. The substrate is heated to a temperature of about 800° C., and the platinum is diffused into the substrate as its temperature is increased at a rate of about 5° C./minute to a first selected temperature of about 850-950° C. Platinum diffusion is continued while the substrate is maintained at the first selected temperature for about 30-60 minutes. The substrate temperature is then increased at a rate of about 5° C./minute to a second selected temperature above 950° C. to about 1000° C., and the substrate is maintained at the second selected temperature for about 5-30 minutes before cooling.


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