Method of manufacturing a semiconductor device

Abstract

In the known method, a semiconductor element ( ) is provided with two connecting conductors ( ) by arranging, preferably a large number of elements ( ) between first and a second conductive plate ( ), the two connecting conductors ( ) secured at the upper surface and lower surface of an element ( ) being formed from the two plates ( ). The first connecting conductor ( ) is formed from a part ( ) of the first plate ( ) which borders on an opening ( ), and the element ( ) is covered with a protective envelope ( ). The known method has the drawback that the devices obtained are not always directly suitable for surface mounting. Furthermore, the reliability of the device is sub-optimal. In a method in accordance with the invention, the second connecting conductor ( ) of the element ( ) is formed by electroconductively securing a part ( B) of the second plate ( ) to a further part ( A) of the first plate ( ), which further part borders on the opening ( ), is situated opposite the part ( ) of the first plate ( ), and from said further part the second connecting conductor ( ) is made. In this relatively simple manner, namely without the necessity of bending the two connecting conductors ( ) after the provision of the protective envelope ( ), a device is obtained which can suitably be used for surface mounting. In addition, for several reasons the reliability of the device obtained is improved, so that the method can very suitably be used for so-called medium or high-power elements ( ).