Inter-electrode connection structure, inter-electrode connection method, semiconductor device, semiconductor mounting method, liquid crystal device, and electronic apparatus

Abstract

Conductive connection can be effected between electrodes arranged at a minute pitch. When joining an IC chip ( ), which is a semiconductor device, to an external substrate ( ), conductive paste ( ) is sprayed in particles to terminals ( ) on the external substrate ( ) and the conductive paste ( ) is put on the electrodes ( ). Next, positioning of pads ( ) of the IC chip ( ) is effected with respect to the conductive paste ( ) and, in this condition, the IC chip ( ) and the substrate ( ) are glued to each other. Since the conductive paste ( ) is sprayed in particles and printed on the electrodes ( ), it is possible to correctly put the conductive paste ( ) thereon even when the electrodes ( ) are arranged at a minute pitch. Further, since conduction is effected between the pads ( ) and the electrodes ( ) through the conductive paste ( ), the conduction state is stable. This conductive connection method is suitably applicable to the connection between substrate side electrodes formed on a substrate and element side electrodes formed on an electronic element mounted on the substrate in a variety of devices such as liquid crystal devices and electronic apparatuses.