The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2002

Filed:

Sep. 07, 1999
Applicant:
Inventors:

Tatemi Ido, Kodaira, JP;

Takamitsu Nagara, Kodaira, JP;

Hirokazu Ichikawa, Tokorozawa, JP;

Akira Kuwahara, Fujisawa, JP;

Taira Kinoshita, Kokubunji, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04J 1/402 ; G02B 6/36 ; G02B 6/12 ; G02B 6/26 ;
U.S. Cl.
CPC ...
H04J 1/402 ; G02B 6/36 ; G02B 6/12 ; G02B 6/26 ;
Abstract

A method is supported for aligning the height of a polymer waveguide to the height of a core layer of a semiconductor element in an optical module composed so as to mount the semiconductor element on its polymer waveguide substrate. In order to achieve the method, at first a waveguide is formed on the silicon substrate coated with an oxide film using a polymer whose refractive index is larger than that of the oxide film. The waveguide consists of a lower cladding layer, a core layer, and an upper cladding layer. The lower cladding layer is formed to be thinner than the conventional one and the height of the core layer is set to 5 to 10 &mgr;m. In this way, it is possible to fabricate an optical module in less process steps and at a lower cost than the conventional one.


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