The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 12, 2002

Filed:

Apr. 30, 1999
Applicant:
Inventors:

Herman L. Jones, Wenatche, WA (US);

Edward A. Taylor, East Wenatchee, WA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 1/504 ; H01L 2/314 ; H05K 7/20 ;
U.S. Cl.
CPC ...
B32B 1/504 ; H01L 2/314 ; H05K 7/20 ;
Abstract

Electronics packages having a primary metallic material, such as a titanium metallic material, metallurgically bonded to one or more secondary regions within the primary metallic material, the composite regions having desirable thermal conductivity properties and having a coefficient of thermal expansion (“CTE”) that generally matches the CTE of the primary metallic material are provided. Electronics packages comprising titanium having heat sinks comprising a metal matrix material such as aluminum silicon carbide or a composite metallic structure such as titanium aluminide/copper, are described. Methods for manufacturing electronics packages having a composite structure are also disclosed.


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