The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2002
Filed:
Jun. 26, 2000
Hirokazu Inoue, Tokai-mura, JP;
Ryuichi Saito, Hitachi, JP;
Mutsuhiro Mori, Mito, JP;
Yasutoshi Kurihara, Hitachinaka, JP;
Jin Onuki, Hitachi, JP;
Shin Kimura, Hitachi, JP;
Satoshi Shimada, Hitachi, JP;
Kazuhiro Suzuki, Mito, JP;
Yukio Kamita, Hitachi, JP;
Isao Kobayashi, Naka-machi, JP;
Kazuji Yamada, Hitachi, JP;
Naohiro Momma, Hitachi, JP;
Other;
Abstract
A semiconductor module has a plurality of power semiconductor devices mounted on a substrate, and a metal foil for wiring is mounted on the substrate so that an asymmetric unit arrangement of the semiconductor devices is formed. In the device, all of the units are arranged in the same direction on the substrate, and all of the units are electrically connected with electrode terminal feet, and the electrode terminal feet are electrically connected with linkage terminal foot. The electrode terminal feet are disposed with a certain interval.