The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2002

Filed:

Jan. 24, 2000
Applicant:
Inventors:

Stefan Grötsch, Regensburg, DE;

Hans-Ludwig Althaus, Lappersdorf, DE;

Werner Späth, Holzkirchen, DE;

Georg Bogner, Hainsacker, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 2/620 ;
U.S. Cl.
CPC ...
B23K 2/620 ;
Abstract

An apparatus for producing a chip-substrate connection, in particular by soldering a semiconductor chip on a substrate. The apparatus has a support, on which the substrate is temporarily supported, and a heating device which is provided for forming the chip-substrate connection. The heating device has a radiation source in the form of a laser in the infrared wavelength range. The support is formed by a heat body, which is assigned to the chip-substrate connection and is heated with thermal radiation by the radiation source. A surface of the heat body is coated with a material, in particular a material containing chromium, exhibiting high absorption with respect to the light radiation emitted by the radiation source.


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