The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2002
Filed:
Feb. 01, 2000
Heinz Förderer, Grosskrotzenburg, DE;
Thomas Frey, Hanau, DE;
Günter Herklotz, Bruchköbel, DE;
W. C. Heraeus GmbH & Co. KG, Hanau, DE;
Abstract
A method for the manufacture of a leadless substrate with a basic body made of copper or copper base alloy, a solder layer applied to at least one portion of the basic body and made of metals belonging to the group of gold, gold alloy, silver, silver alloy, palladium, and palladium alloy, as well as an intermediate layer arranged between the basic body and the solder layer and made of nickel or nickel alloy, wherein the solder layer consists of at least two separate layers made of different metals and wherein the intermediate layer and the separate layers are deposited by electroplating, characterized in that at least one separate layer is made of silver or silver alloy.