The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2002
Filed:
May. 08, 2000
Alec J. Babiarz, Encinitas, CA (US);
Carlos Edward Bouras, Encinitas, CA (US);
Drusilla Bertone Cursi, Encinitas, CA (US);
Alan Ray Lewis, Carlsbad, CA (US);
Jason Thomas Vint, La Mesa, CA (US);
Nordson Corporation, Westlake, OH (US);
Abstract
A method and apparatus for underfilling a gap between a multi-sided semiconductor device and a substrate with viscous underfill material. The viscous underfill material is moved into the gap to encapsulate a plurality of electrical interconnections formed between the semiconductor device and the substrate. A seal is provided between the semiconductor device and the substrate to seal the gap along multiple sides of the device, while the gap is left unsealed along at least one side of the device to permit fluid communication with the gap. The viscous underfill material is dispensed adjacent the at least one side of the device along which the gap is unsealed, and a pressure differential is created across the underfill material to draw the underfill material into the gap and thereby encapsulate the electrical interconnections.