The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6352072 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 05, 2002

Filed:

Jul. 25, 2001
Applicant:
Inventors:

Hideki Honma, Saitama, JP;

Katsuaki Kaneko, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B25D 1/08 ;
U.S. Cl.
CPC ...
B25D 1/08 ;
Abstract

An ingot support device for slicing silicon is produced by molding a molding material obtained by blending an acrylic resin or an unsaturated polyester resin and one or more inorganic fillers selected from the group consisting of aluminum hydroxide, barium sulphate, barium carbonate, calcium carbonate and silica. According to the present invention, there is provided an ingot support device for slicing silicon which can be produced easily at a low cost, which has enough strength to cope with the upsizing of the ingot block, has high adhesive properties with the ingot block, and has other further improved properties which are required of the ingot support device for slicing silicon.


Find Patent Forward Citations

Honma, Hideki. (2002). Ingot support device for slicing silicon (U.S. Patent No. 6352072). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6352072

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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