The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2002
Filed:
Oct. 22, 1998
Toshiyuki Tsujii, Tokyo, JP;
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
Provided is a semiconductor device capable of performing a function test and a DC test including an output voltage test every time a test jig is sequentially caused to come in contact with pads of the semiconductor device. The semiconductor device comprises a principal plane ( ) of a semiconductor substrate, and pads ( ) provided on the principal plane ( ). The principal plane ( ) is provided with four probing areas (PA ) to (PA ) with which the test jig comes in contact. A large number of pads ( ) include four sets of driving pads ( ) for supplying a driving voltage, and four sets of boundary scanning pads (BSP) for performing boundary scan. Even if it comes in contact with any of the probing areas (PA ) to (PA ), the test jig comes in contact with the driving pads ( ) and the boundary scanning pads (BSP).