The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2002
Filed:
Jun. 29, 1998
Yoshiro Takahashi, Tokyo, JP;
Kei Nakakuki, Tokyo, JP;
Satoshi Itaya, Tokyo, JP;
Kayo Hamano, Tokyo, JP;
Abstract
An electronic component having a multi-layered printed circuit board made of an organic material, a plurality of electronic components mounted in a face-down position on the multi-layered printed circuit board, a metal cover for covering the plurality of electronic components remaining a space or a cavity between the top surface of the printed circuit board and the inner surface of the metal cover having a flange surrounding the outskirts of the metal cover to be adhered to the top surface of the multi-layered printed circuit board, and a heat conductive member packed between the bottom surface of the electronic components, wherein the multi-layered printed circuit board has at least one through-hole vertically penetrating the multi-layered printed circuit board at a location corresponding to the flange and is lined by a metal film, and the multi-layered printed circuit board has a heat conductive layer arranged along the rear surface of the multi-layered printed circuit board, the heat conductive layer being connected to a metal lining of the through-hole.