Composite piezoelectric component and chip-type composite piezoelectric component

Abstract

A composite piezoelectric component includes a plurality of piezoelectric resonant elements. Each of the plurality of piezoelectric resonant elements includes a substrate having a first major surface and a second major surface disposed opposite to each other. A pair of vibrating electrodes is disposed on the first and second major surfaces, respectively, so as to oppose each other with the substrate disposed therebetween. A ground electrode which is connected to ground is disposed on at least one of the first and second major surfaces. The plurality of piezoelectric resonant elements are stacked on each other so that the major surface of one substrate opposes the major surface of another substrate. A conductive joining member electrically connects at least two of the vibrating electrodes and the ground electrode of the plurality of piezoelectric resonant elements and mechanically bonds the stacked piezoelectric resonant elements. Each of the substrates of the of the piezoelectric resonant elements other than the piezoelectric resonant element located on the top portion includes a plurality of piezoelectric substrate portions, a conductive material portion arranged between the plurality of piezoelectric substrate portions, with the ground electrodes being provided on the first and second major surfaces of the substrate in the conductive material portion. The plurality of ground electrodes of the piezoelectric resonant elements are electrically connected to one another via the conductive material portions and the conductive joining members.