The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2002
Filed:
Mar. 22, 2000
Makoto Iijima, Kawasaki, JP;
Masaru Nukiwa, Kawasaki, JP;
Seiji Ueno, Kawasaki, JP;
Muneharu Morioka, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A semiconductor device includes a multi-flexible substrate and semiconductor chips mounted thereon. The multi-flexible substrate is configured such that organic insulation substrate layers and filmy adhesive layers are alternatively stacked together and wiring layers formed therein are interconnected by means of vias. Each of the vias consisting of a via-hole which is formed penetrating both the organic insulation substrate layers and the filmy adhesive layers and a metal via member which is provided in the via-hole and made of an identical material. A method of manufacturing the multi-flexible substrate for the semiconductor device is also disclosed.