The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 26, 2002

Filed:

May. 23, 2000
Applicant:
Inventors:

Masuo Koshi, Ikoma, JP;

Tadahiko Sugimoto, Kadoma, JP;

Takeshi Onobayashi, Osaka, JP;

Kenichirou Todoroki, Hirakata, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22D 4/108 ;
U.S. Cl.
CPC ...
B22D 4/108 ;
Abstract

To provide a jet solder feeding device enabling the prevention of poor wetting of a substrate and molten solder which may occur due to gas or air accumulated under the bottom surface of a substrate when the substrate is conveyed to the point where it is fed with molten solder. The jet solder feeding device is designed in such a manner that multiple ejecting ports are provided in more than one rows relative to the substrate-conveying direction and arranged at a second prescribed pitch in lines substantially along multiple inclined lines which are inclined to the substrate-conveying direction and arranged at a first prescribed pitch relative to the direction perpendicular to the substrate-conveying direction, the first prescribed pitch being set to be larger than the second prescribed pitch, so that a flow of molten solder passing through midway between groups of the ejecting ports is positively created.


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