The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2002
Filed:
Dec. 29, 1999
Israel Dubin, Sugar Land, TX (US);
Charles M. Erwin, Cupertino, CA (US);
Radisys Corporation, Hillsboro, OR (US);
Abstract
The present invention relates to a method and apparatus of heat dispersion from the bottom side of an integrated circuit package mounted on a printed circuit board (“PCB”). In operation, a heat slug is thermally coupled to the underside of an integrated circuit (“IC”) package. In one embodiment, the heat slug comprises a disc made of copper or other thermally conductive material in between two layers of elastomeric, conductive material such as silicone imbedded with aluminum particles. The thermal pad extends through each layer of the PCB, including the ground layer. In this way, the ground layer of the PCB is utilized for heat dispersion.