The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 19, 2002

Filed:

Jan. 25, 1999
Applicant:
Inventor:

John MacPherson, Fremont, CA (US);

Assignee:

Clear Logic, Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H01L 2/940 ; G01R 3/126 ; G09K 3/00 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H01L 2/940 ; G01R 3/126 ; G09K 3/00 ;
Abstract

A bond pad structure is provided which has a primary bond pad region electrically connected to a secondary bond pad region. The secondary bond pad region is used to test a circuit for configuration, while the primary bond pad is covered with a protective oxide. After configuration and etching to complete desired disconnections, the oxide is removed from the primary bond pad region, leaving an undamaged surface for subsequent wire bonding. The primary bond pad region and the secondary bond pad region can be a unitary structure or two separate structures.


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