The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2002
Filed:
Sep. 29, 1998
Charles Franklin Drill, Boulder Creek, CA (US);
VSLI Technology, Inc., San Jose, CA (US);
Abstract
A slurry dispensing carrier ring for confining a semiconductor wafer to a polishing pad in a chemical mechanical polishing machine. The slurry dispensing ring has a diameter and a lower surface substantially parallel to the plane defined by the diameter and an inner radius surface substantially orthogonal to the plane defined by the diameter. The inner radius surface is adapted to confine the semiconductor wafer. An outer radius surface is located opposite the inner radius surface. An upper surface is located opposite the lower surface. A slurry dispense hole extends through the carrier ring from the upper surface to the lower surface, wherein the slurry dispense hole is adapted to flow a slurry used for chemical mechanical polishing from the chemical mechanical polishing machine to the lower surface so that the slurry contacts the semiconductor wafer confined within the inner radius surface. This provides for the more efficient utilization of slurry in the CMP process wherein a planar topography is created on the semiconductor wafer. This facilitates the subsequent semiconductor processing steps performed on the semiconductor wafer and minimizes the amount of wasted slurry.