The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2002
Filed:
Feb. 28, 2000
David T. Frost, San Jose, CA (US);
Lam Research Corporation, Fremont, CA (US);
Abstract
A system for chemical mechanical polishing, and a method of chemical mechanical polishing and the preparation of wafer surfaces is provided. The preparation can either be a polishing operation or a buffing operation. The chemical mechanical polishing system includes a carrier to hold and rotate a wafer. The wafer has a surface area and is held by the carrier so that the surface area of the wafer to be processed is exposed. The system further includes a roller that has a process surface. The roller is configured to rotate about an axis, and the rotating process surface of the roller is applied with force against the rotating wafer surface defining a contact region on the wafer. The area of the contact region is less than the surface area of the wafer. The contact region is moved between a first region of the wafer and a second region of the wafer during the processing of the wafer, and the force and linear velocity are manipulated to control a rate of removal.