The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 19, 2002
Filed:
Apr. 19, 1999
Applicant:
Inventor:
Hiroyuki Miki, Ibaraki, JP;
Assignee:
SMC Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
F28F 7/00 ;
U.S. Cl.
CPC ...
F28F 7/00 ;
Abstract
In order to provide a cooling/heating apparatus for a semiconductor processing liquid being highly resistant to corrosive chemicals and free from elution of harmful impurities, a heat exchanging substrate is formed by heat-depositing a fluorine-contained resin sheet B to a processing liquid contact surface of a graphite substrate A.
Quick Actions:
Miki, Hiroyuki. (2002). Cooling/heating apparatus for semiconductor processing liquid (U.S. Patent No. 6347661). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6347661
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