The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 12, 2002
Filed:
Jul. 14, 1999
Gang Chen, Horseheads, NY (US);
Lyle David Kinney, Bath, NY (US);
Emmanuel C Onyiriuka, Painted Post, NY (US);
Mike Xu Ouyang, Corning, NY (US);
Laura Weller-Brophy, Corning, NY (US);
Corning Incorporated, Corning, NY (US);
Abstract
A copper-gallium alloy is deposited on a nonconductive substrate, such as glass, ceramic, or polymeric material, to provide a conductor to which solder will readily adhere, such that electrical contacts to photonic and electrical components can be made. The copper-gallium thin film can also be used to provide a surface for solder sealing a component within a hermetically sealed enclosure. In a preferred embodiment, the copper-gallium alloy was from about 1 to about 40 percent gallium to about 99 to about 60 percent copper and was deposited to a thickness of from about 400 nanometers to about 3 microns. The copper-gallium film is deposited utilizing sputtering or electron beam deposition equipment.