The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 12, 2002

Filed:

Nov. 15, 1999
Applicant:
Inventors:

Hideaki Nakakubo, Kyoto, JP;

Toshio Ishizaki, Kobe, JP;

Toru Yamada, Katano, JP;

Hiroshi Kagata, Hirakata, JP;

Tatsuya Inoue, Takatsuki, JP;

Shoichi Kitazawa, Nishinomiya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P 1/203 ; H01P 7/08 ;
U.S. Cl.
CPC ...
H01P 1/203 ; H01P 7/08 ;
Abstract

By using a method for manufacturing a dielectric laminated. device, an opening is formed on a first dielectric sheet, a strip line and an input and output line including an input and output electrode are formed by burying electrode materials in said opening, the first dielectric sheet is laminated with the second and third dielectric sheets disposed above and below respectively to form a laminate, a first and second shield electrodes and a ground electrode are formed, an end of the strip line is connected to the ground electrode, the first shield electrode and the second shield electrode are mutually connected through the ground electrode, and the input and output electrode is exposed along the line direction of the strip line. By this constitution of the above dielectric laminated device, the mounting reliability of the dielectric laminated device can be further increased.


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