The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2002
Filed:
Jul. 16, 1999
Applicant:
Inventor:
Yoshihiro Tomita, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01H 2/302 ; H01L 2/312 ; H01L 2/314 ; H01L 2/353 ; H01L 2/348 ; H01L 2/352 ;
U.S. Cl.
CPC ...
H01H 2/302 ; H01L 2/312 ; H01L 2/314 ; H01L 2/353 ; H01L 2/348 ; H01L 2/352 ;
Abstract
A semiconductor element is mounted on a main substrate with its primary surface downward, and the electrodes of the semiconductor element are connected to the electrodes of the main substrate. A wiring board having a wiring pattern is placed on the backside of the semiconductor element. Four corners of the wiring board are connected to the main substrate by means of connection pins. The connection pins are formed so as to become conductive to thereby electrically connect the wiring pattern of the main substrate to the wiring pattern of the wiring board.