The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 2002
Filed:
Aug. 15, 2000
Koya Nomura, Shimonoseki, JP;
Kobe Steel, Ltd., Kobe, JP;
Abstract
Provided is a copper alloy for electrical or electronic parts which is superior in yield strength, electric conductivity, spring limit value, resistance property of stress relaxation, bendability and Sn plating property. The copper alloy for electrical or electronic parts comprises Fe: 0.5-2.4% (“%” means “% by mass”, which is the same hereinafter.), Si: 0.02-0.1%, Mg: 0.01-0.2%, Sn: 0.01-0.7%, Zn: 0.01-0.2%, Pb: 0.0005-0.015%, P: less than 0.03%, Ni: 0.03% or less, and Mn: 0.03% or less, and further comprises Cu and inevitable impurities as the balance of the copper alloy.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile