The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 2002
Filed:
Dec. 18, 1998
Applicant:
Inventor:
Osamu Kitade, Hyogo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 2/358 ;
U.S. Cl.
CPC ...
H01C 2/358 ;
Abstract
There is described a semiconductor wafer suitable for efficiently testing a plurality of logic chips formed thereon without damaging input/output sections of the chips. A plurality of chips, a test circuit, and output pads are formed on a semiconductor wafer. A plurality of input pads of the test circuit are connected to terminals corresponding to all the chips by way of a test pattern. The chips are connected to the output pads by means of test patterns. All the chips are subjected to a test (or multi-test) through use of the test circuit and the output pads. The test circuit and the output pads are provided in the peripheral area of the semiconductor wafer.