The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 2002
Filed:
Apr. 30, 1997
Tomoaki Hirokawa, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
In a semiconductor device mold package composed of a mold cap and a mold case both of which are formed of a resin compound and which are joined to each other to form a hollow inner space defined and encapsulated by the mold cap and the mold case, the mold cap has a recess defined by an inner wall surface and surrounded by a flat mouth portion, for the purpose of forming the above mentioned hollow inner space. The mold cap is constructed to fulfill a relation of a-b≧t and a-b≦b where “a” is a height from the mouth portion to a top of an outer wall surface, “b” is a height from the mouth portion to a top of the inner wall surface, and “t” is a thickness of the mold cap at the mouth portion.