The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 2002
Filed:
Mar. 09, 2000
Ralph I. Larson, Bolton, MA (US);
Heat Technology, Inc., Sterling, MA (US);
Abstract
A heatsink interface material for securing a heatsink to an integrated circuit includes a core material having an adhesive forced into opposing surfaces of the core material. It is preferred that an intermediate region of the core material be free of adhesive. In one embodiment, copper is deposited on the first and second surfaces of the core material and then nickel is deposited on the first and second surfaces. An exemplary method for fabricating a heatsink interface material in accordance with the present invention can include applying heat and pressure to force adhesive into the core material. Copper and nickel can be deposited on the core material surfaces using electroless deposition techniques.