The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 15, 2002
Filed:
Dec. 09, 1999
Applicant:
Inventors:
Masaharu Shirai, Kusatsu, JP;
Shinji Yamada, Ohtsu, JP;
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/06 ; H05K 3/46 ; G03F 7/26 ; G03F 7/38 ;
U.S. Cl.
CPC ...
H05K 3/06 ; H05K 3/46 ; G03F 7/26 ; G03F 7/38 ;
Abstract
The method of producing a wiring board comprises the steps of: preparing a photosensitive resin layer; pressing the photosensitive resin layer; exposing the pressed photosensitive resin layer to light by using a exposure mask on which a predetermined pattern is formed; and developing the exposed photosensitive resin layer.
Shirai, Masaharu. (2002). Lithography method and method for producing a wiring board (U.S. Patent No. 6338937). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6338937
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile