The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 15, 2002
Filed:
Jun. 29, 2000
Yukio Takigawa, Kawasaki, JP;
Ei Yano, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A semiconductor encapsulating resin composition which is powdery particles of a resin composition comprising an epoxy resin, a curing agent and an inorganic filler, and produced through a series of unit operations inclusive of melt-kneading and pulverization of a raw material mixture, wherein foreign metal having magnetic property originating from metal materials constituting production apparatuses used in the unit operations and contained in the powdery particles are selectively recovered and removed by a drum type metal classification-recovering apparatus. This semiconductor encapsulating resin composition provides a high reliability semiconductor device not containing magnetic foreign metal.