The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 15, 2002
Filed:
Feb. 13, 1998
Yoshihiro Yoshimura, Yamaguchi, JP;
Katunari Nishimura, Yamaguchi, JP;
Takumi Murata, Yamaguchi, JP;
Masahiro Yamada, Yamaguchi, JP;
Mitsui Chemicals, Inc., Tokyo, JP;
Abstract
A pipe molding die of the present invention is capable of rectifying a flow of a molten resin by a resin reservoir and uniformizing the flow of the resin extruded from the die in whichever position in a peripheral direction on a flow path within the die. Consequently, ununiformity in wall thickness of the resin pipe to be molded can be eliminated. The pipe molding die comprises a throttle part as one of components thereof, which includes a core, a shell part fitted to the core and a resin reservoir as a portion of a flow path which is formed between the core and the shell part. A molten, resin as a pipe raw material flows through the flow path. The resin reservoir is provided in at least one of the core and the shell part, and takes a ring-like shape circumscribing a central axis of the pipe molding die with the central axis centered. The resin reservoir assumes a recessed shape in cross-section.